AMD/Xilinx XC6VCX75T-1FFG784I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology.

In Stock ActiveAMD/XilinxVirtex®-6 CXT XC6VCX75FCBGARoHS

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XC6VCX75T-1FFG784I

Manufacturer

Part Number (MPN)

XC6VCX75T-1FFG784I

Category

Integrated Circuits (ICs)Embedded Processors and Controllers FPGAs (Field Programmable Gate Array)

Series

Base Model

Detailed Description

Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 dedicated DSP multipliers (25x18), 12 transceiver blocks operating at 3.75 Gbps, and 1 Ethernet MAC. This surface-mount device is housed in a 784-pin Flip Chip Ball Grid Array (FCBGA) package, measuring 29mm x 29mm with a 1mm pin pitch. Operating temperature range is -40 °C to 100 °C.

Package

FCBGA

Key Features

Package: FCBGA

Lifecycle Status

Active

RoHS State

RoHS Compliant

Datasheet

XC6VCX75T-1FFG784I Datasheet

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Competitive Pricing

Fast & Reliable Delivery

Quality Assured

Technical Specifications

AMD/Xilinx XC6VCX75T-1FFG784I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS

Yes

Number of Pins

784

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C

Basic Package Type

Ball Grid Array

Package Family Name

BGA

Package

FCBGA

Package Description

Flip Chip Ball Grid Array

Lead Shape

Ball

Pcb

784

Alternate Parts Comparison (XC6VCX75T-1FFG784I vs XC6VCX75T-1FFG784C vs XC6VCX75T-2FFG784I vs XC6VCX75T-1FF484C)

Side-by-side technical parameter comparison of related primary models in this product family.

	This Part	Alternate Parts	Alternate Parts	Alternate Parts
	AMD/XilinxXC6VCX75T-1FFG784I	AMD/XilinxXC6VCX75T-1FFG784C	AMD/XilinxXC6VCX75T-2FFG784I	AMD/XilinxXC6VCX75T-1FF484C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C	0°C ~ 85°C	-40°C ~ 100°C	0°C ~ 85°C
Number of Pins	784	784	784	484
RoHS	Yes	Yes	Yes	No
AEC Qualified	No	No	No	No
Automotive	No	No	No	No
Basic Package Type	Ball Grid Array	Ball Grid Array	Ball Grid Array	Ball Grid Array
Cage Code	68994	68994	68994	68994
Dedicated DSP	288	288	288	288
Device Logic Cells	74496	74496	74496	74496
Ethernet Macs	1	1	1	1
Family Name	Virtex®-6 CXT	Virtex®-6 CXT	Virtex®-6 CXT	Virtex®-6 CXT
Action	RFQ	RFQ	RFQ	RFQ

AMD/Xilinx XC6VCX75T-1FFG784I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 dedicated DSP multipliers (25x18), 12 transceiver blocks operating at 3.75 Gbps, and 1 Ethernet MAC. This surface-mount device is housed in a 784-pin Flip Chip Ball Grid Array (FCBGA) package, measuring 29mm x 29mm with a 1mm pin pitch.

Operating temperature range is -40 °C to 100 °C.

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XC6VCX75T-1FFG784C

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XC6VCX75T-1FFG484I

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Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology.

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XC6VCX75T-2FF484I AMD/Xilinx

Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology.

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Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology.

XC6VCX75T-2FFG784C

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Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology.

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