AMD/Xilinx XC6SLX75T-3FGG676C FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers.
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX75T-3FGG676C
Category
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers. Features 3096 Kbit RAM, 264 (18x18) multipliers, and 132 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
XC6SLX75T-3FGG676C Datasheet
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Technical Specifications
AMD/Xilinx XC6SLX75T-3FGG676C FPGAs (Field Programmable Gate Array) technical specifications.
General
RoHS
Yes
Number of Pins
676
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
676
Alternate Parts Comparison (XC6SLX75T-3FGG676C vs XC6SLX75-3CSG484I vs XC6SLX75-3FGG484C vs XC6SLX75-2CSG484I)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Package | FBGA | 484-FBGA, CSPBGA | 484-BBGA | 484-FBGA, CSPBGA |
| Package / Case | -- | 484-CSPBGA | 484-FBGA | 484-CSPBGA |
| Supply Voltage | -- | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Number of I/O | -- | 328 | 280 | 328 |
| Number of LABs/CLBs | -- | 5831 | 5831 | 5831 |
| Number of Logic Elements Cells | -- | 74637 | 74637 | 74637 |
| Total RAM Bits | -- | 3170304 | 3170304 | 3170304 |
| Action |
AMD/Xilinx XC6SLX75T-3FGG676C FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers. Features 3096 Kbit RAM, 264 (18x18) multipliers, and 132 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting.
Operates within a temperature range of 0°C to 85°C.
More Parts in FPGAs (Field Programmable Gate Array)
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
XC6SLX75T-2CSG484IAMD/XilinxField Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology.
XC6SLX75T-3FGG484IAMD/XilinxField Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology.
XC6SLX75T-2FGG484IAMD/XilinxField Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology.
XC6SLX75T-3FGG484CAMD/XilinxField Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers.