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AMD/Xilinx XC6SLX45-3FGG484C FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology.

11,111 ActiveAMD/XilinxXC6SLX45FBGA$50.06RoHS
XC6SLX45-3FGG484C - No Image Available

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XC6SLX45-3FGG484C
Manufacturer
Part Number (MPN)
XC6SLX45-3FGG484C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. Offers 316 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. This surface-mount device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 23mm x 23mm x 1.7mm with a 1mm pin pitch. Operates within a temperature range of 0°C t...
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX45-3FGG484C Datasheet
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Ordering Code Family

XC6SLX45 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

84 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX45-3FGG484C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
Yes
Number of Pins
484
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
484

Alternate Parts Comparison (XC6SLX45-3FGG484C vs XC6SLX45-3FGG676C vs XC6SLX45-L1CSG324I vs XC6SLX45T-3FG484C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C
PackageFBGA676-BGA324-LFBGA, CSPBGAFBGA
Number of Pins484----484
RoHSYes----No
AEC QualifiedNo----No
AutomotiveNo----No
Basic Package TypeBall Grid Array----Ball Grid Array
Cage Code68994----68994
Dedicated DSP58----58
Device Logic Cells43661----43661
Device Number of Dlls Plls12----12
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AMD/Xilinx XC6SLX45-3FGG484C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. Offers 316 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM.

This surface-mount device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 23mm x 23mm x 1.7mm with a 1mm pin pitch. Operates within a temperature range of 0°C t...

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