Winbond Electronics W29N01HWBINF Flash Memory
IC FLASH 1GBIT PARALLEL 63VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N01HWBINF
Detailed Description
Package
VFBGA
Key Features
Package / Case: 63-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 1Gb (128M x 8)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N01HWBINF Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
No
Ppap
No
Mounting Type
Surface Mount
Package Height
0.6(Max)
Package Width
9
Package Length
11
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W71NW20GF3FWWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2Gbit (NAND), 1Gbit (LPDDR2) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 162 | Organization: 16Mx8 Flash + 2Mx32 DDR2 DRAM
W29N02KZBIBFWinbond ElectronicsPackage / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2Gb (256M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
W25Q16FWSNIQWinbond ElectronicsPackage: Tray | Package / Case: 8-SOIC (0.154", 3.90mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W25Q64JVSSIQWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 64M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8