Winbond Electronics W25Q32JWSNIM Flash Memory
IC FLASH 32MBIT SPI/QUAD 8SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q32JWSNIM
Detailed Description
Package
SO
Key Features
Package: SO; Package / Case: 8-SOIC (0.154", 3.90mm Width); Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 32M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W25Q32JWSNIM Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q32JWSNIM Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
32M
Architecture
Sectored
Boot Block
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q64JVSSIQWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 64M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8
W25Q80DVSSIGWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 8M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8
W25X40CLSNIGWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 4M | Interface: Serial (SPI, Dual SPI) | Number of Pins: 8
W25Q256JVFIQWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 16