Winbond Electronics W25Q256JWPIQ/REEL Flash Memory
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 256M-bit 32M x 8 6ns 8-Pin WSON EP T/R/Tray/Tube
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256JWPIQ/REEL
Detailed Description
Package
SON
Key Features
Package: SON; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 256M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q256JWPIQ/REEL Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active
Svhc
Yes
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
256M
Architecture
Sectored
Boot Block
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25X05CLUXIGWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 2.5/3.3 | Memory Size: 512K | Interface: Serial (SPI, Dual SPI) | Number of Pins: 8
W25X20CLUXIGWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 2M | Interface: Serial (SPI, Dual SPI) | Number of Pins: 8
W25Q16JWZPIQWinbond ElectronicsPackage: SON | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.8 | Memory Size: 16M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W25Q32FVZEIGWinbond ElectronicsPackage: SON | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 32M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8