Winbond Electronics W25Q256JVMIQ Flash Memory
IC FLASH 256MBIT SPI/QUAD 8WFLGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256JVMIQ
Detailed Description
IC FLASH 256MBIT SPI/QUAD 8WFLGA
Package
LGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q256JVMIQ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q256JVMIQ Flash Memory technical specifications.
General
RoHS
Compliant
Lifecycle Status
Active
Automotive
Yes
Cell Type
NOR
Memory Size
256M
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width Bit
32
Sector Size
4Kbyte x 8192
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W25Q256JVMIMWinbond ElectronicsPackage: LGA | Package / Case: 8-WLGA Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W25Q16FWSNIQWinbond ElectronicsPackage: Tray | Package / Case: 8-SOIC (0.154", 3.90mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
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