Winbond Electronics W25N512GWBIR Flash Memory
IC FLASH 512MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25N512GWBIR
Series
Detailed Description
Package
24-TFBGA (6x8)
Key Features
Package: Tray; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 512Mbit; Interface: SPI
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25N512GWBIR Flash Memory technical specifications.
General
Max Frequency
104 MHz
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
24-TFBGA (6x8)
Access Time
7 ns
Package / Case
24-TBGA
Technology
FLASH - NAND (SLC)
Supply Voltage
1.7V ~ 1.95V
Reach Status
REACH Unaffected
Mfr
Winbond Electronics
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q128JVSIQTRWinbond ElectronicsPackage: Reel | Package / Case: SOIC-8 | Memory Size: 128 Mbit | Interface: SPI | Organization: 16 M x 8
W25Q128FVPIQWinbond ElectronicsPackage: Tube | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)