Winbond Electronics W25M512JVEIM Flash Memory
IC FLASH 512MBIT SPI/QUAD 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M512JVEIM
Detailed Description
Package
SON
Key Features
Package: SON; Package / Case: 8-WDFN Exposed Pad; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 512M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active-Unconfirmed
RoHS State
Compliant
Datasheet
W25M512JVEIM Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25M512JVEIM Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active-Unconfirmed
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
512M
Architecture
Sectored
Boot Block
Yes
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