Samsung Semiconductor KLMBG2JETD-B0410 Flash Memory
Flash, 32GX8, PBGA153, FBGA-153
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
KLMBG2JETD-B0410
Detailed Description
Package
--
Key Features
Supply Voltage: 1.8/3.3; Memory Size: 256G; Interface: Serial e-MMC
Lifecycle Status
Obsolete-Unconfirmed
RoHS State
Compliant
Datasheet
KLMBG2JETD-B0410 Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor KLMBG2JETD-B0410 Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Obsolete-Unconfirmed
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
MLC NAND
Memory Size
256G
Architecture
Sectored
Boot Block
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K8D3216UBC-PI07Samsung SemiconductorNumber of Pins: 48 | Max Operating Temp: 85 | Min Operating Temp: -40 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G48 | Temperature Grade: INDUSTRIAL
K9F1208R0C-JIB0Samsung SemiconductorNumber of Pins: 63 | Max Operating Temp: 85 | Min Operating Temp: -40 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B63 | Width: 8.5