Renesas TSE2002GB2A1NCG Thermal Management
IC TEMP SENS EEPROM DFN-8
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TSE2002GB2A1NCG
Detailed Description
Package
8-WFDFN Exposed Pad
Key Features
Package / Case: 8-WFDFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
TSE2002GB2A1NCG Datasheet
Quick Jump:
Technical Specifications
Renesas TSE2002GB2A1NCG Thermal Management technical specifications.
General
Operating Temperature
-20°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-WFDFN Exposed Pad
Output Type
I²C/SMBus
Supplier Device Package
8-VFQFPN (2x3)
Supply Voltage
2.3V ~ 3.6V
Sensor Type
Internal
Topology
ADC, Register Bank
Accuracy
±2°C
Sensing Temperature
-20°C ~ 125°C
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