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Renesas R9A06G037GNP#AA0 System On Chip (SoC)

SOC PLC MODEM LSI SMART GRID ASS

1,989 ActiveRenesas64-VFQFN Exposed PadRoHS
R9A06G037GNP#AA0 - No Image Available

Same model may have multiple batches, images only for reference.

R9A06G037GNP#AA0
Manufacturer
Part Number (MPN)
R9A06G037GNP#AA0
Detailed Description
Package
64-VFQFN Exposed Pad
Key Features
Package / Case: 64-VFQFN Exposed Pad
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PDF R9A06G037GNP#AA0 Datasheet
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Technical Specifications

Renesas R9A06G037GNP#AA0 System On Chip (SoC) technical specifications.

General

Operating Temperature
-40°C ~ 85°C (TA)
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-HVQFN (9x9)
Peripherals
PWM
Architecture
DSP, MCU
Number of I/O
16
Speed
138MHz
Core Processor
ARM® Cortex®-M3
RAM Size
128KB
Connectivity
CSI, I²C, UART

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