NXP Semiconductors MM912KS812AMAFR2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT HCS12 100LQFP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MM912KS812AMAFR2
Detailed Description
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MM912KS812AMAFR2 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MM912KS812AMAFR2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Interface
CAN, SCI, SPI
Supplier Device Package
100-LQFP-EP (14x14)
Supply Voltage
4.7V ~ 36V
Number of I/O
6
Core Processor
S12XS
RAM Size
12K x 8
Program Memory Type
FLASH (256kB)
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.