NXP Semiconductors MC33PF8200DEESR2 Integrated Circuits (ICs)
POWER MANAGEMENT IC I.MX8 PRE-PR
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC33PF8200DEESR2
Base Model
Detailed Description
Package
56-VFQFN Exposed Pad
Key Features
Package: 56-VFQFN Exposed Pad; Supply Voltage: 2.5V ~ 5.5V
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
MC33PF8200DEESR2 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC33PF8200DEESR2 Integrated Circuits (ICs) technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount, Wettable Flank
Package
56-VFQFN Exposed Pad
Supplier Device Package
56-HVQFN (8x8)
Supply Voltage
2.5V ~ 5.5V
Applications
High Performance i.MX 8, S32x Processor Based
Package / Case
56-VFQFN Exposed Pad
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.