NXP Semiconductors LPC812M101FDH16FP Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 16TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC812M101FDH16FP
Detailed Description
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
LPC812M101FDH16FP Datasheet
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Technical Specifications
NXP Semiconductors LPC812M101FDH16FP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package
16-TSSOP
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
14
Speed
30MHz
Core Processor
ARM® Cortex®-M0+
RAM Size
4K x 8
Program Memory Type
Flash
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