NXP Semiconductors LPC3143FET180,551 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16/32BIT ROMLESS 180TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC3143FET180,551
Detailed Description
Package
180-TFBGA
Key Features
Package / Case: 180-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
LPC3143FET180,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC3143FET180,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
180-TFBGA
Supplier Device Package
180-TFBGA (12x12)
Peripherals
DMA, I²S, LCD, PWM, WDT
Number of I/O
20
Speed
270MHz
Core Processor
ARM926EJ-S
RAM Size
192K x 8
Program Memory Type
ROMless
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