NXP Semiconductors LPC11A02UK,118 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 16KB FLASH 20WLCSP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC11A02UK,118
Detailed Description
Package
20-UFBGA, WLCSP
Key Features
Package / Case: 20-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC11A02UK,118 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors LPC11A02UK,118 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
20-UFBGA, WLCSP
Supplier Device Package
20-WLCSP (2.55x2.55)
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
18
Speed
50MHz
EEPROM Size
2K x 8
Core Processor
ARM® Cortex®-M0
RAM Size
4K x 8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.