Micron Technology Inc. NAND02GR3B2DZA6E Flash Memory
IC FLASH 2GBIT PARALLEL 63VFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NAND02GR3B2DZA6E
Detailed Description
Package
63-VFBGA (9.5x12)
Key Features
Package: Tray; Package / Case: 63-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 2Gbit
Lifecycle Status
Discontinued at Digi-Key
RoHS State
Compliant
Datasheet
NAND02GR3B2DZA6E Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. NAND02GR3B2DZA6E Flash Memory technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
256M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Discontinued at Digi-Key
Supplier Device Package
63-VFBGA (9.5x12)
Access Time
45 ns
Write Cycle Time Word Page
45ns
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
NAND01GR3B2CZA6EMicron Technology Inc.Package: Tray | Package / Case: 63-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
NAND02GW3B2DZA6EMicron Technology Inc.Package: Tray | Package / Case: 63-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 85°C (TA)
NAND01GW3B2CZA6EMicron Technology Inc.Package: Tray | Package / Case: 63-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
M29DW323DT70N6EMicron Technology Inc.Package: Tray | Package / Case: 48-TFSOP (0.724", 18.40mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 32Mbit | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 48