Micron Technology Inc. MT29F8G08ADADAH4:D Flash Memory
SLC NAND Flash Parallel 3.3V 8G-bit 1G x 8 63-Pin VFBGA Tray
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F8G08ADADAH4:D
Detailed Description
Package
VFBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 3.3; Memory Size: 8G; Interface: Parallel
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MT29F8G08ADADAH4:D Datasheet
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Technical Specifications
Micron Technology Inc. MT29F8G08ADADAH4:D Flash Memory technical specifications.
General
Fbga Marking Code
NW226
Program Current Ma
35
HTS
8542.32.00.71
ECCN
EAR99
Ppap
No
Operating Current Ma
35
Automotive
No
Command Compatible
No
Min Operating Temp
0
Max Operating Temp
70
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MT29F2G08ABBGAH4-IT:GMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F2G08ABBEAH4-IT:EMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F4G08ABBDAH4:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: 0°C ~ 70°C (TA) | Number of Pins: 63
MT29F4G08ABBDAHC-IT:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63