Micron Technology Inc. MT29F256G08EBHAFB16A3WC1ES Flash Memory
IC Flash TLC 256G Die 32GX8
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F256G08EBHAFB16A3WC1ES
Detailed Description
Package
Die
Key Features
Package / Case: Die; Mounting Type: Surface Mount; Supply Voltage: 2.5V ~ 3.6V; Memory Size: 256Gb (32G x 8)
Lifecycle Status
Unconfirmed
RoHS State
Supplier Unconfirmed
Datasheet
MT29F256G08EBHAFB16A3WC1ES Datasheet
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Technical Specifications
Micron Technology Inc. MT29F256G08EBHAFB16A3WC1ES Flash Memory technical specifications.
General
HTS
COMPONENTS
Lifecycle Status
Unconfirmed
RoHS
Supplier Unconfirmed
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
Die
Technology
FLASH - NAND (TLC)
Supplier Device Package
Die
Memory Size
256Gb (32G x 8)
Memory Type
Non-Volatile
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