Micron Technology Inc. MT29F256G08CBCBBL06B3WC1 Flash Memory
IC FLASH 256GBIT PARALLEL DIE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F256G08CBCBBL06B3WC1
Detailed Description
IC FLASH 256GBIT PARALLEL DIE
Package
Die
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MT29F256G08CBCBBL06B3WC1 Datasheet
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Technical Specifications
Micron Technology Inc. MT29F256G08CBCBBL06B3WC1 Flash Memory technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Obsolete
Supplier Device Package
Die
Memory Size
256Gbit
Package / Case
Die
Technology
FLASH - NAND (MLC)
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