Micron Technology Inc. MT29F1G08ABCH4:C Flash Memory
SLC NAND Flash Serial 1.8V 1G-bit 128M x 8 30ns 63-Pin VFBGA Tray
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F1G08ABCH4:C
Detailed Description
Package
VFBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 1G; Interface: Serial
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Micron Technology Inc. MT29F1G08ABCH4:C Flash Memory technical specifications.
General
Fbga Marking Code
NW221
Program Current Ma
20
ECCN
EAR99
Ppap
No
Operating Current Ma
20
Automotive
No
Command Compatible
No
Address Bus Width Bit
28
Min Operating Temp
0
Max Operating Temp
70
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MT29F2G08ABBGAH4-IT:GMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F2G08ABBEAH4-IT:EMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F4G08ABBDAH4:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: 0°C ~ 70°C (TA) | Number of Pins: 63
MT29F4G08ABBDAHC-IT:DMicron Technology Inc.Package: BGA | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 4G | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63