Microchip Technology VSC8582XKS-09 Telecom
IC TELECOM INTERFACE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
VSC8582XKS-09
Detailed Description
Package
256-BGA
Key Features
Package / Case: 256-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
VSC8582XKS-09 Datasheet
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Technical Specifications
Microchip Technology VSC8582XKS-09 Telecom technical specifications.
General
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
256-BGA
Interface
GMII, SerDes, SPI, TBI
Supplier Device Package
256-PBGA (17x17)
Number of Circuits
1
Supply Voltage
1V
Function
Ethernet
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