ISSI® IS25WX256-JHLA3 Flash Memory
IC FLASH 256MBIT SPI/OCT 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS25WX256-JHLA3
Detailed Description
IC FLASH 256MBIT SPI/OCT 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
IS25WX256-JHLA3 Datasheet
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Technical Specifications
ISSI® IS25WX256-JHLA3 Flash Memory technical specifications.
General
RoHS
Compliant
Lifecycle Status
Active
Automotive
Yes
Ppap
Yes
Cell Type
NOR
Memory Size
256M
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width Bit
32
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IS25LP256D-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLEISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS29GL256-70DLEBISSI®Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64