ISSI® IS25WX256-JHLA3 Flash Memory
IC FLASH 256MBIT SPI/OCT 24TFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS25WX256-JHLA3
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 256M; Interface: Serial (Octal SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
ISSI® IS25WX256-JHLA3 Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
Yes
Ppap
Yes
Cell Type
NOR
Memory Size
256M
Architecture
Sectored
Boot Block
No
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Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64