ISSI® IS25WE01G-RILA3 Flash Memory
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 128M x 8 11ns Automotive AEC-Q100 24-Pin LFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS25WE01G-RILA3
Detailed Description
Package
LFBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 1G; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Unknown
RoHS State
Compliant
Datasheet
IS25WE01G-RILA3 Datasheet
Quick Jump:
Technical Specifications
ISSI® IS25WE01G-RILA3 Flash Memory technical specifications.
General
Bank Size
128M
Program Current Ma
45
HTS
8542.32.00.71
ECCN
3A991.b.1.a
Programming Voltage V
1.7 to 1.95
Ppap
Yes
Operating Current Ma
50
Automotive
Yes
Command Compatible
Yes
Address Bus Width Bit
32
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
IS22TF32G-JQLA1-TRISSI®Package / Case: 100-LBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 32G | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 100
IS21TF16G-JQLI-TRISSI®Package / Case: 100-LBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128G | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 100
IS25WP016D-JNLEISSI®Package: SO | Mounting Type: Surface Mount | Supply Voltage: 1.8 | Memory Size: 16M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8
IS25LP080D-JNLE-TRISSI®Package: SO | Package / Case: 8-SOIC (0.154", 3.90mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 8M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 8