ISSI® IS22TF32G-JQLA2 Flash Memory
Managed NAND Flash Serial e-MMC 3.3V 256G-bit 32G x 8 Automotive AEC-Q100 100-Pin LFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS22TF32G-JQLA2
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 3.3; Memory Size: 256G; Interface: Serial e-MMC
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
ISSI® IS22TF32G-JQLA2 Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
Yes
Ppap
Yes
Cell Type
Managed NAND
Memory Size
256G
Architecture
Sectored
Boot Block
Yes
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Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64