Infineon Technologies S34ML04G100BHI003 Flash Memory
SLC NAND Flash Parallel 3V/3.3V 4G-bit 512M x 8 63-Pin BGA T/R

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S34ML04G100BHI003
Detailed Description
Package
BGA
Key Features
Package / Case: 63-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 4G; Interface: Parallel
Lifecycle Status
Unknown
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies S34ML04G100BHI003 Flash Memory technical specifications.
General
Program Current Ma
40
HTS
8542.32.00.51
ECCN
3A991b.1.a.
Ppap
No
Operating Current Ma
30
Automotive
No
Command Compatible
Yes
Min Operating Temp
-40
Max Operating Temp
85
Supplier Package
BGA
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
S29GL032N90FFI030Infineon TechnologiesPackage: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 32M | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 64
S29AL016J70BFI020Infineon TechnologiesPackage: BGA | Package / Case: 48-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 16M | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 48
S29GL128S11FHIV20Infineon TechnologiesPackage: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 64
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.8 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24