Analog Devices DS1230Y-70+ NV RAM (FRAM, MRAM, nvSRAM)
IC NVSRAM 256KBIT PAR 28EDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS1230Y-70+
Detailed Description
Package
28-EDIP
Key Features
Package: Tube; Package / Case: 28-DIP Module (0.600", 15.24mm); Mounting Type: Through Hole; Supply Voltage: 4.5V ~ 5.5V; Memory Size: 256Kbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Analog Devices DS1230Y-70+ NV RAM (FRAM, MRAM, nvSRAM) technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
32K x 8
Mounting Type
Through Hole
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
28-EDIP
Access Time
70 ns
Write Cycle Time Word Page
70ns
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DS1230AB-200Analog DevicesPackage: Tube | Package / Case: 28-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.75V ~ 5.25V | Memory Size: 256Kbit | Operating Temperature: 0°C ~ 70°C (TA)
DS1230AB-200INDAnalog DevicesPackage: Tube | Package / Case: 28-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.75V ~ 5.25V | Memory Size: 256Kbit | Operating Temperature: -40°C ~ 85°C (TA)
DS1230AB-70INDAnalog DevicesPackage: Tube | Package / Case: 28-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.75V ~ 5.25V | Memory Size: 256Kbit | Operating Temperature: -40°C ~ 85°C (TA)
DS1230Y-70INDAnalog DevicesPackage: Tube | Package / Case: 28-DIP Module (0.600", 15.24mm) | Mounting Type: Through Hole | Supply Voltage: 4.5V ~ 5.5V | Memory Size: 256Kbit | Operating Temperature: -40°C ~ 85°C (TA)