AMD/Xilinx XC6SLX100T-4FGG676C FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers.
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX100T-4FGG676C
Category
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers. Features 4.824 Mbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps and one PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73mm with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
XC6SLX100T-4FGG676C Datasheet
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Technical Specifications
AMD/Xilinx XC6SLX100T-4FGG676C FPGAs (Field Programmable Gate Array) technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
676
Pcb
676
Package Length Mm
27
Package Width Mm
27
Package Height Mm
1.73
AMD/Xilinx XC6SLX100T-4FGG676C FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers. Features 4.824 Mbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps and one PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73mm with a 1mm pin pitch, suitable for surface mounting.
Operates within a temperature range of 0°C to 85°C.
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