AMD/Xilinx XC6SLX100-2FGG900C FPGAs (Field Programmable Gate Array)
High-performance FPGA with 101,261 logic cells and 126,576 registers, built on 45nm process technology.
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX100-2FGG900C
Category
Base Model
Detailed Description
High-performance FPGA with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Offers 576 user I/Os and 3.2 Gbps transceiver speed. Packaged in a 900-pin FBGA (31x31mm, 1.75mm height) for surface mounting, operating from 0°C to 85°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
XC6SLX100-2FGG900C Datasheet
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Technical Specifications
AMD/Xilinx XC6SLX100-2FGG900C FPGAs (Field Programmable Gate Array) technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
900
Pcb
900
Package Length Mm
31
Package Width Mm
31
Package Height Mm
1.75
AMD/Xilinx XC6SLX100-2FGG900C FPGAs (Field Programmable Gate Array) Overview
High-performance FPGA with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Offers 576 user I/Os and 3.2 Gbps transceiver speed. Packaged in a 900-pin FBGA (31x31mm, 1.75mm height) for surface mounting, operating from 0°C to 85°C.
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