AMD/Xilinx XC6SLX100-2FG900I FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology.
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX100-2FG900I
Category
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 576 maximum user I/Os, 4824 Kbit RAM, 360 (18x18) multipliers, and 180 dedicated DSP blocks. Operates with 18 DLLs/PLLs and offers 3.2 Gbps transceiver speed. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
XC6SLX100-2FG900I Datasheet
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Technical Specifications
AMD/Xilinx XC6SLX100-2FG900I FPGAs (Field Programmable Gate Array) technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
900
Pcb
900
Package Length Mm
31
Package Width Mm
31
Package Height Mm
1.75
AMD/Xilinx XC6SLX100-2FG900I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 576 maximum user I/Os, 4824 Kbit RAM, 360 (18x18) multipliers, and 180 dedicated DSP blocks. Operates with 18 DLLs/PLLs and offers 3.2 Gbps transceiver speed. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting.
Extended operating temperature range from -40°C to 100°C.
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